HSS03-B20-P318 CUI Devices

Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS03-B20-P318 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS03-B20-P318 13.67 16.9 5.6 4.5 5.49 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 16.9 5.6 4.5 2 31.9 11.4 8.6 40 3 45.1 17.0 12.8 4 57.8 22.8 17.0 20 5 69.6 28.3 20.9 6 80.8 34.1 25.1 0 012345678 91011 7 92.0 39.4 29.3 8 102.5 45.3 33.6 Heat Dissipated (W) 9 113.4 50.9 37.8 10 123.7 56.8 42.0 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS03-B20-P318 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 1050 tolerance: 0.3 mm FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL phosphor bronze PIN PLATING 2~3 m tin WEIGHT 7.6 g cuidevices.com