HSS04-B20-P318 CUI Devices

Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS04-B20-P318 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS04-B20-P318 12.79 15.8 5.5 4.5 5.86 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 Heatsink Temperature Rise Above 200LFM Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 15.8 5.5 4.5 2 30.5 11.2 8.5 40 3 43.3 16.9 12.4 4 55.1 22.6 16.3 20 5 66.3 28.1 20.3 6 76.8 33.7 24.2 0 0123456789 10 11 7 87.1 39.2 28.2 8 97.1 45.0 32.2 Heat Dissipated (W) 9 106.8 50.8 36.3 10 117.4 56.6 40.6 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS04-B20-P318 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 1050 tolerance: 0.3 mm FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL phosphor bronze PIN PLATING 2~3 m tin WEIGHT 8.0 g cuidevices.com