X-On Electronics has gained recognition as a prominent supplier of HSS06-C20-P32 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSS06-C20-P32 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSS06-C20-P32 CUI Devices

HSS06-C20-P32 electronic component of CUI Devices
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Part No.HSS06-C20-P32
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, stamping, TO-220, 27.96 x 22
Datasheet: HSS06-C20-P32 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.2301 ea
Line Total: USD 1.23 
Availability - 5041
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
5041
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ : 1
Multiples : 1
1 : USD 1.2301
10 : USD 1.1631
500 : USD 1.1519
1000 : USD 1.1128
6000 : USD 1.0524

   
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We are delighted to provide the HSS06-C20-P32 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSS06-C20-P32 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS06-C20-P32 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin copper alloy tin plated 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS06-C20-P32 25.35 30.4 10.6 7.5 2.96 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 30.4 10.6 7.5 2 55.4 21.0 15.1 40 3 77.7 31.1 22.5 4 98.4 41.5 30.2 20 5 118.4 51.9 37.4 Ths: hot spot temperature measured on the heatsink 0 Ta: ambient temperature 0123456 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS06-C20-P32 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL C1100 tolerance: 0.25 mm FINISH tin THICKNESS 0.6 mm WEIGHT 7.7 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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