X-On Electronics has gained recognition as a prominent supplier of HSS07-C20-P274 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSS07-C20-P274 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSS07-C20-P274 CUI Devices

HSS07-C20-P274 electronic component of CUI Devices
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Part No.HSS07-C20-P274
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, stamping, TO-220, 21.66 x 13.
Datasheet: HSS07-C20-P274 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.3975 ea
Line Total: USD 1.4 
Availability - 282
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
282
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 1.3975
10 : USD 1.2821
25 : USD 1.259
50 : USD 1.2012
100 : USD 1.155
250 : USD 1.1204
500 : USD 1.0961
1000 : USD 1.0049
6000 : USD 0.9979

   
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We are delighted to provide the HSS07-C20-P274 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSS07-C20-P274 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS07-C20-P274 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin copper alloy tin plated 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS07-C20-P274 29.57 35.5 12.6 8.9 2.54 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 160 Without Airow 140 200 LFM Heatsink Temperature Rise Above 120 400 LFM Ambient (T = Ths - Ta) (C) Power Natural 100 200 LFM 400 LFM (W) Conv. 0 0 0 0 80 1 35.5 12.6 8.9 60 2 64.5 24.6 17.7 3 90.9 36.6 26.3 40 4 115.1 49.3 35.2 5 137.4 60.4 43.8 20 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 012345 6 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS07-C20-P274 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL C1100 tolerance: 0.25 mm FINISH tin THICKNESS 0.6 mm WEIGHT 4.5 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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