HSS10-B20-P40 CUI Devices

Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS10-B20-P40 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS10-B20-P40 18.12 21.9 7.9 6.1 4.14 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM 100 Heatsink Temperature Rise Above 400 LFM Ambient (T = Ths - Ta) (C) 80 Power Natural 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 1 21.9 7.9 6.1 40 2 40.1 15.7 11.6 3 56.5 23.4 17.4 20 4 72.7 31.3 22.7 5 88.0 38.8 28.2 0 6 101.3 47.2 34.0 0123456789 7 114.3 54.7 39.7 Heat Dissipated (W) 8 127.3 61.2 44.9 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS10-B20-P40 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 1050 tolerance: 0.25 mm FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL brass PIN PLATING 2~3 m tin WEIGHT 5.0 g cuidevices.com