HSS11-B20-P38 CUI Devices

Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS11-B20-P38 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS11-B20-P38 15.76 20.0 6.9 5.2 4.76 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM 100 Heatsink Temperature Rise Above 400 LFM Ambient (T = Ths - Ta) (C) 80 Power Natural 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 1 20.0 6.9 5.2 40 2 36.7 13.6 10.1 3 52.2 20.1 14.8 20 4 65.8 26.6 19.6 5 79.7 33.0 24.3 0 6 92.2 39.8 29.3 0123456789 7 104.1 46.1 34.0 Heat Dissipated (W) 8 116.5 52.1 38.6 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS11-B20-P38 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 1050 tolerance: 0.38 mm FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL brass PIN PLATING 2~3 m tin WEIGHT 5.3 g cuidevices.com