HSS13-B20-NP CUI Devices

Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS13-B20-NP DESCRIPTION: HEAT SINK FEATURES TO-220 package slide in attachment aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS13-B20-NP 15.50 19.1 7.7 5.8 4.84 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 160 Without Airow 140 200 LFM 120 Heatsink Temperature Rise Above 400 LFM Ambient (T = Ths - Ta) (C) 100 Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 19.1 7.7 5.8 2 35.6 15.0 11.1 40 3 49.5 22.2 16.4 20 4 63.9 29.3 21.7 5 77.1 35.9 26.8 0 6 88.1 43.5 32.3 0 123456789 10 11 7 100.6 50.1 37.4 Heat Dissipated (W) 8 113.4 56.8 42.4 9 123.8 64.5 47.8 10 134.5 70.4 53.2 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS13-B20-NP DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 5052 tolerance: 0.38 mm FINISH black anodized THICKNESS 1.2 mm WEIGHT 6.0 g cuidevices.com