HSS14-B20-NP CUI Devices

Additional Resources: Product Page 3D Model date 06/28/2021 page 1 of 3 MODEL: HSS14-B20-NP DESCRIPTION: HEAT SINK FEATURES TO-220 package slide in attachment aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS14-B20-NP 23.90 28.6 11.6 8.5 3.14 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 200 LFM Heatsink Temperature Rise Above 80 400 LFM Ambient (T = Ths - Ta) (C) Power Natural 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 1 28.6 11.6 8.5 40 2 52.8 22.7 16.7 3 73.2 33.6 24.9 20 4 92.4 44.6 33.0 5 111.5 55.0 41.1 0 Ths: hot spot temperature measured on the heatsink 0123456 Ta: ambient temperature Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS14-B20-NP DESCRIPTION: HEAT SINK date 06/28/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 5052 tolerance: 0.25 mm FINISH black anodized THICKNESS 0.6 mm WEIGHT 2.1 g cuidevices.com