HSS-B20-0503H CUI Devices

Additional Resources: Product Page 3D Model PCB Footprint date 02/12/2020 page 1 of 3 MODEL: HSS-B20-0503H DESCRIPTION: HEAT SINK FEATURES TO-220 package round hole for component attachment solder pins for secure PCB mounting black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-0503H 16.30 19.73 5.44 4.22 4.60 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 70 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 50 1 19.73 5.44 4.22 2 37.51 11.67 8.80 40 3 51.61 18.00 13.39 30 4 66.98 24.70 18.04 20 5 80.49 30.86 22.95 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 01 23 45 Dissipated Power (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices SERIES: HSS-B20-0503H DESCRIPTION: HEAT SINK date 02/12/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1050 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL brass PIN PLATING tin WEIGHT 6.0 g cuidevices.com