HSS-B20-0508H-01S CUI Devices

Additional Resources: Product Page 3D Model date 02/12/2020 page 1 of 3 SERIES: HSS-B20-0508H DESCRIPTION: HEAT SINK FEATURES TO-220 package round or slot hole attachment options three tabs for stable PCB placement black anodized finish 1 mounting hole thermal resistance power MODEL 1 dissipation type size 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-0508H-01R round 3.81 15.83 20.74 5.87 4.22 4.74 HSS-B20-0508H-01S slot 3.9 x 9.52 15.83 20.74 5.87 4.22 4.74 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 70 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 50 1 20.74 5.87 4.22 40 2 37.04 11.20 8.21 3 51.71 16.65 12.28 30 4 65.89 22.18 16.35 20 5 78.28 27.93 20.51 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 0 12345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSS-B20-0508H DESCRIPTION: HEAT SINK date 02/12/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1050 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.2 mm HSS-B20-0508H-01R: 4.3 g WEIGHT HSS-B20-0508H-01S: 4.3 g HSS-B20-0508H-01R HSS-B20-0508H-01S cuidevices.com