HSS-B20-0635H CUI Devices

Additional Resources: Product Page 3D Model PCB Footprint date 02/13/2020 page 1 of 4 SERIES: HSS-B20-0635 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin for secure PCB mounting round hole for component attachment black anodized finish 1 thermal resistance power MODEL 1 dissipation fin height 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-0635H 6.35 28.85 35.46 10.68 7.88 2.60 HSS-B20-0635H-01 9.53 27.78 33.93 9.51 6.84 2.70 HSS-B20-0635H-02 12.70 29.09 33.89 10.49 6.81 2.58 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES HSS-B20-0635H 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM 70 (W) Conv. 60 0 0 0 0 1 35.46 10.68 7.88 50 2 59.42 20.81 15.77 40 3 83.82 31.59 23.83 30 4 101.40 41.80 31.52 20 5 122.52 52.02 38.83 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 0123 45 Dissipated Power (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices SERIES: HSS-B20-0635 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 4 PERFORMANCE CURVES (CONTINUED) HSS-B20-0635H-01 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM 70 (W) Conv. 0 0 0 0 60 1 33.93 9.51 6.84 50 2 58.86 20.45 14.91 40 3 81.12 31.36 22.45 30 4 100.66 40.98 30.96 20 5 121.15 51.38 38.04 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 0123 45 Dissipated Power (W) HSS-B20-0635H-02 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM 70 (W) Conv. 60 0 0 0 0 1 33.89 10.49 6.81 50 2 60.40 20.20 13.50 40 3 84.56 30.26 19.87 30 4 100.59 40.17 26.37 20 5 112.14 49.67 32.37 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 01 23 45 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Mounting Surface Temperature Rise Above Ambient (C) Rise Above Ambient (C)