X-On Electronics has gained recognition as a prominent supplier of HSS-B20-0635H-01 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSS-B20-0635H-01 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSS-B20-0635H-01 CUI Devices

HSS-B20-0635H-01 electronic component of CUI Devices
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Part No.HSS-B20-0635H-01
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sink Passive TO-220 Vertical Thru-Hole Aluminum 1050 Black Anodized
Datasheet: HSS-B20-0635H-01 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.5082 ea
Line Total: USD 0.51 
Availability - 1917
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1940
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 50
Multiples : 50
50 : USD 0.6133
500 : USD 0.4835
1000 : USD 0.4334
3000 : USD 0.429
5000 : USD 0.4149
8000 : USD 0.4107
15000 : USD 0.4066
25000 : USD 0.4026

1917
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.5082
10 : USD 0.4678
25 : USD 0.4493
50 : USD 0.4343
100 : USD 0.425
250 : USD 0.4065
500 : USD 0.3904
1000 : USD 0.3615
5000 : USD 0.3477

   
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We are delighted to provide the HSS-B20-0635H-01 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSS-B20-0635H-01 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model PCB Footprint date 02/13/2020 page 1 of 4 SERIES: HSS-B20-0635 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin for secure PCB mounting round hole for component attachment black anodized finish 1 thermal resistance power MODEL 1 dissipation fin height 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-0635H 6.35 28.85 35.46 10.68 7.88 2.60 HSS-B20-0635H-01 9.53 27.78 33.93 9.51 6.84 2.70 HSS-B20-0635H-02 12.70 29.09 33.89 10.49 6.81 2.58 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES HSS-B20-0635H 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM 70 (W) Conv. 60 0 0 0 0 1 35.46 10.68 7.88 50 2 59.42 20.81 15.77 40 3 83.82 31.59 23.83 30 4 101.40 41.80 31.52 20 5 122.52 52.02 38.83 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 0123 45 Dissipated Power (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices SERIES: HSS-B20-0635 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 4 PERFORMANCE CURVES (CONTINUED) HSS-B20-0635H-01 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM 70 (W) Conv. 0 0 0 0 60 1 33.93 9.51 6.84 50 2 58.86 20.45 14.91 40 3 81.12 31.36 22.45 30 4 100.66 40.98 30.96 20 5 121.15 51.38 38.04 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 0123 45 Dissipated Power (W) HSS-B20-0635H-02 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM 70 (W) Conv. 60 0 0 0 0 1 33.89 10.49 6.81 50 2 60.40 20.20 13.50 40 3 84.56 30.26 19.87 30 4 100.59 40.17 26.37 20 5 112.14 49.67 32.37 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 01 23 45 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Mounting Surface Temperature Rise Above Ambient (C) Rise Above Ambient (C)

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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