HSS-B20-0953H-01 CUI Devices

Additional Resources: Product Page 3D Model PCB Footprint date 02/11/2020 page 1 of 3 SERIES: HSS-B20-04 DESCRIPTION: HEAT SINK FEATURES TO-220 package available with and without solder pins slide in style for easy component attachment black anodized finish 1 solder pin thermal resistance power MODEL 1 dissipation orientation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-061H-01 horizontal 6.1 33.28 37.62 11.04 8.48 2.25 HSS-B20-0953H-01 horizontal 9.53 33.28 37.62 11.04 8.48 2.25 HSS-B20-NP-07 no pin -- 33.28 37.62 11.04 8.48 2.25 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 90 Power Natural 80 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 37.62 11.04 8.48 50 2 67.10 22.01 16.80 3 94.67 32.92 24.82 40 4 116.45 43.78 32.98 30 Without Airflow 5 135.00 55.12 41.47 20 200 LFM Ths: hot spot temperature measured on the heatsink 10 Ta: ambient temperature 400 LFM 0 012345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices SERIES: HSS-B20-04 DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL5052 tolerance: 0.5 mm FINISH black anodized THICKNESS 0.8 mm PIN MATERIAL brass PIN PLATING tin HSS-B20-061H-01: 1.6 g WEIGHT HSS-B20-0953H-01: 1.6 g HSS-B20-NP-07: 1.3 g HSS-B20-061H-01 HSS-B20-0953H-01 HSS-B20-NP-07 cuidevices.com