HSS-B20-0953H-02 CUI Devices

Additional Resources: Product Page 3D Model PCB Footprint date 02/13/2020 page 1 of 3 SERIES: HSS-B20-07 DESCRIPTION: HEAT SINK FEATURES TO-220 package available with and without solder pin slide in style for easy component attachment black anodized finish 1 solder pin thermal resistance power MODEL 1 dissipation orientation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-061H-02 horizontal 6.1 25.92 30.86 7.24 6.25 2.89 HSS-B20-0953H-02 horizontal 9.53 25.92 30.86 7.24 6.25 2.89 HSS-B20-065V-02 vertical 6.5 25.92 30.86 7.24 6.25 2.89 HSS-B20-NP-10 no pin -- 25.92 30.86 7.24 6.25 2.89 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Without Airflow 90 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 70 200 LFM 400 LFM (W) Conv. 60 0 0 0 0 50 1 30.86 7.24 6.25 40 2 55.34 14.06 11.16 3 75.79 21.12 16.22 30 4 95.80 28.34 21.52 20 5 109.77 35.58 26.70 10 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 01 23 45 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices SERIES: HSS-B20-07 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL5052 tolerance: 0.5 mm FINISH black anodized THICKNESS 0.8 mm PIN MATERIAL brass PIN PLATING tin HSS-B20-061H-02: 1.8 g HSS-B20-0953H-02: 1.8 g WEIGHT HSS-B20-065V-02: 1.8 g HSS-B20-NP-10: 1.7 g HSS-B20-061H-02 HSS-B20-0953H-02 HSS-B20-065V-02 HSS-B20-NP-10 cuidevices.com