HSS-B20-CP-01 CUI Devices

Additional Resources: Product Page 3D Model date 02/13/2020 page 1 of 3 MODEL: HSS-B20-CP-01 DESCRIPTION: HEAT SINK FEATURES TO-220 package with clip for easy component attachment low profile design black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-CP-01 28.85 32.65 6.32 4.85 2.60 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 32.65 6.32 4.85 2 59.76 12.95 10.42 50 3 84.63 19.75 15.69 40 4 104.13 26.62 20.71 30 5 122.18 33.69 26.11 20 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 10 0 01 23 45 Dissipated Power (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS-B20-CP-01 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1050 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.0 mm WEIGHT 1.9 g cuidevices.com