HSS-B20-NP CUI Devices

Additional Resources: Product Page 3D Model PCB Footprint date 02/11/2020 page 1 of 3 SERIES: HSS-B20-01 DESCRIPTION: HEAT SINK FEATURES TO-220 package available with and without solder pin slide in style for easy component attachment black anodized finish 1 solder pin thermal resistance power MODEL 1 dissipation orientation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-061H horizontal 6.1 18.63 23.05 5.01 4.01 4.02 HSS-B20-0953H horizontal 9.53 18.63 23.05 5.01 4.01 4.02 HSS-B20-065V vertical 6.5 18.63 23.05 5.01 4.01 4.02 HSS-B20-NP no pin -- 18.63 23.05 5.01 4.01 4.02 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 23.05 5.01 4.01 50 2 42.19 9.68 7.89 40 3 57.90 14.39 11.64 30 4 74.85 18.96 15.57 5 88.08 23.63 19.26 20 Ths: hot spot temperature measured on the heatsink 10 Ta: ambient temperature 0 01 23 45 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices SERIES: HSS-B20-01 DESCRIPTION: HEAT SINK date 02/11/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL5052 tolerance: 0.5 mm FINISH black anodized THICKNESS 0.8 mm PIN MATERIAL brass PIN PLATING tin HSS-B20-061H: 3.1 g HSS-B20-0953H: 3.1 g WEIGHT HSS-B20-065V: 3.1 g HSS-B20-NP: 3.0 g HSS-B20-061H HSS-B20-0953H HSS-B20-065V HSS-B20-NP cuidevices.com