HSS-B20-NP-04 CUI Devices

Additional Resources: Product Page 3D Model date 02/13/2020 page 1 of 3 MODEL: HSS-B20-NP-04 DESCRIPTION: HEAT SINK FEATURES TO-220 package round hole for component attachment two hole options for longer component pins black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-NP-04 11.54 15.27 3.76 2.74 6.50 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 200 LFM 400 LFM 80 400 LFM (W) Conv. 0 0 0 0 70 1 15.27 3.76 2.74 60 2 27.05 7.51 5.43 50 3 38.74 11.26 8.23 4 48.62 15.04 11.17 40 5 59.41 18.81 13.89 30 6 69.24 22.56 16.83 20 7 79.43 26.28 19.71 8 88.27 30.18 22.48 10 9 95.85 33.95 25.41 0 01 23 45 6789 10 10 104.56 37.87 28.29 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS-B20-NP-04 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1050 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.0 mm WEIGHT 5.7 g cuidevices.com