HSS-B20-NP-06 CUI Devices

Additional Resources: Product Page 3D Model date 02/13/2020 page 1 of 3 MODEL: HSS-B20-NP-06 DESCRIPTION: HEAT SINK FEATURES TO-220 package round hole for component attachment low profile design black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-NP-06 26.32 31.94 7.51 5.84 2.85 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 31.94 7.51 5.84 50 2 56.44 14.85 11.53 3 79.15 22.50 17.26 40 4 100.39 30.12 23.17 30 5 116.77 37.08 28.81 20 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 10 0 012345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS-B20-NP-06 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1050 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.2 mm WEIGHT 1.7 g cuidevices.com