HSS-B20-NP-12 CUI Devices

Additional Resources: Product Page 3D Model date 02/13/2020 page 1 of 3 MODEL: HSS-B20-NP-12 DESCRIPTION: HEAT SINK FEATURES TO-220 package round hole for component attachment two hole options for longer components pins black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-NP-12 11.03 14.33 3.47 2.42 6.80 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) Without Airflow 90 200 LFM Power Natural 200 LFM 400 LFM 80 400 LFM (W) Conv. 0 0 0 0 70 1 14.33 3.47 2.42 60 2 26.13 7.20 4.89 50 3 37.06 11.03 7.60 4 47.31 14.48 10.02 40 5 58.11 18.05 12.62 30 6 68.23 21.56 15.13 20 7 77.41 25.39 17.88 8 84.32 29.25 20.46 10 9 90.32 32.97 23.03 0 01 23 45 6 789 10 10 95.09 37.42 26.04 Dissipated Power ( W ) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS-B20-NP-12 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1100 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.0 mm WEIGHT 5.0 g cuidevices.com