HSS-B20-NPR-01 CUI Devices

Additional Resources: Product Page 3D Model date 02/13/2020 page 1 of 3 SERIES: HSS-B20-NPX-01 DESCRIPTION: HEAT SINK FEATURES TO-220 package round or slot hole attachment options black andoized finish aluminum 1 mounting hole thermal resistance power MODEL 1 dissipation type size 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-NPR-01 round 3.81 17.74 22.47 5.88 4.17 4.23 HSS-B20-NPS-01 slot 3.9 x 9.52 17.74 22.47 5.88 4.17 4.23 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 22.47 5.88 4.17 50 2 39.28 11.26 7.41 40 3 56.71 16.66 11.08 4 70.54 21.77 14.72 30 5 85.88 27.51 18.27 20 Ths: hot spot temperature measured on the heatsink 10 Ta: ambient temperature 0 01 23 45 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSS-B20-NPX-01 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1050 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.2 mm HSS-B20-NPR-01: 4.3 g WEIGHT HSS-B20-NPS-01: 4.3 g HSS-B20-NPR-01 HSS-B20-NPS-01 cuidevices.com