HSS-B20-NPR-02 CUI Devices

Additional Resources: Product Page 3D Model date 02/13/2020 page 1 of 3 SERIES: HSS-B20-NPX-02 DESCRIPTION: HEAT SINK FEATURES TO-220 package round or slot hole attachment options black anodized finish aluminum 1 mounting hole thermal resistance power MODEL 1 dissipation type size 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSS-B20-NPR-02 round 3.81 14.71 18.99 4.20 3.00 5.10 HSS-B20-NPS-02 slot 3.9 x 9.52 14.71 18.99 4.20 3.00 5.10 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 200 LFM 400 LFM 400 LFM 80 (W) Conv. 0 0 0 0 70 1 18.99 4.20 3.00 60 2 36.06 8.84 5.97 50 3 49.01 13.51 9.16 4 62.95 17.94 12.37 40 5 73.94 22.27 15.40 30 6 84.05 26.97 18.76 20 7 95.04 31.60 21.79 10 8 105.21 36.59 25.01 9 113.51 40.90 28.42 0 0123456789 10 10 116.17 45.59 31.75 Heat Dissipated (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSS-B20-NPX-02 DESCRIPTION: HEAT SINK date 02/13/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL1050 tolerance: 0.5 mm FINISH black anodized THICKNESS 1.2 mm HSS-B20-NPR-02: 4.3 g WEIGHT HSS-B20-NPS-02: 4.3 g HSS-B20-NPR-02 HSS-B20-NPS-02 cuidevices.com