HSS-C2540-SMT-TR CUI Devices

Additional Resources: Product Page 3D Model PCB Footprint date 03/10/2020 page 1 of 3 MODEL: HSS-C2540-SMT-TR DESCRIPTION: HEAT SINK FEATURES TO-263 package low profile design surface mount tape and reel pack 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-C2540-SMT-TR 19.74 21.90 5.50 4.00 3.80 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 21.90 5.50 4.00 50 2 41.68 11.15 7.79 3 62.55 16.69 12.14 40 4 79.22 22.44 16.40 30 5 98.00 28.21 20.66 20 Ths: hot spot temperature measured on the heatsink 10 Ta: ambient temperature 0 012345 Dissipated Power (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices MODEL: HSS-C2540-SMT-TR DESCRIPTION: HEAT SINK date 03/10/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL C1100 tolerance: 0.3 mm FINISH tin plated THICKNESS 0.6 mm WEIGHT 8.9 g 20.32 (0.800) 2.54 (0.100) 2.54 (0.100) 10.67 (0.420) 16.76 (0.660) Recommended Copper Pad Layout Top View PACKAGING units: mm Reel QTY: 150 pcs per reel 40.4 2 44 36 cuidevices.com