X-On Electronics has gained recognition as a prominent supplier of HSS-C2540-SMT-TR Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSS-C2540-SMT-TR Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSS-C2540-SMT-TR CUI Devices

HSS-C2540-SMT-TR electronic component of CUI Devices
HSS-C2540-SMT-TR CUI Devices
HSS-C2540-SMT-TR Heat Sinks
HSS-C2540-SMT-TR  Thermal Management

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See Product Specifications
Part No. HSS-C2540-SMT-TR
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Tin Plated 19.38 x 25.4 x 11.43 mm Surface Mount Heat Sink
Datasheet: HSS-C2540-SMT-TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
693: USD 0.9774 ea
Line Total: USD 677.34 
Availability - 0
MOQ: 693  Multiples: 900
Pack Size: 900
Availability Price Quantity
3665
Ship by Fri. 02 May to Tue. 06 May
MOQ : 1
Multiples : 1
1 : USD 2.3756
900 : USD 2.0675
4500 : USD 1.4437

   
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We are delighted to provide the HSS-C2540-SMT-TR from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSS-C2540-SMT-TR and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model PCB Footprint date 03/10/2020 page 1 of 3 MODEL: HSS-C2540-SMT-TR DESCRIPTION: HEAT SINK FEATURES TO-263 package low profile design surface mount tape and reel pack 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-C2540-SMT-TR 19.74 21.90 5.50 4.00 3.80 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 21.90 5.50 4.00 50 2 41.68 11.15 7.79 3 62.55 16.69 12.14 40 4 79.22 22.44 16.40 30 5 98.00 28.21 20.66 20 Ths: hot spot temperature measured on the heatsink 10 Ta: ambient temperature 0 012345 Dissipated Power (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices MODEL: HSS-C2540-SMT-TR DESCRIPTION: HEAT SINK date 03/10/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL C1100 tolerance: 0.3 mm FINISH tin plated THICKNESS 0.6 mm WEIGHT 8.9 g 20.32 (0.800) 2.54 (0.100) 2.54 (0.100) 10.67 (0.420) 16.76 (0.660) Recommended Copper Pad Layout Top View PACKAGING units: mm Reel QTY: 150 pcs per reel 40.4 2 44 36 cuidevices.com

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7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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