DA7202 10 W Mono Class-D Amplifier for 2S Battery Devices General description DA7202 is a powerful, high efficiency, low EMI Class-D speaker driver that can drive 10 W into 4 loads directly from a 2S lithium ion battery pack. DA7202 is a standalone high performance mono Class-D audio amplifier targeted at powering a variety of two cell portable applications such as Ultrabooks and tablets. It uses a fully-differential switched mode amplifier architecture with a fixed +18 dB gain, with differential analogue inputs. It also has a PWM modulator and an H-bridged switched power output stage that delivers 8 W into an 8 load, making a speaker sound louder on portable devices. The DA7202 can be directly connected between the two-cell battery and the speaker. Noise suppression circuitry to reduce audible pops and clicks at the speaker output is also included. Available as a 9-bump WL-CSP package with 0.5 mm pitch that is suited to low cost PCB technology, it is ideal for portable applications that require small footprints. Key features PRMS: 3.8 W into 8 load Auto-Shutdown/Start-up: <3.5 ms at 8.2 V, 1% THD+N Ultra low standby current: 7 A Efficiency: 90% POUT = 3.5 W Short-Circuit & Thermal-Overload Protection at 8.2 V, 8 and 85% P = 7.0 W OUT with auto recovery at 8.2 V, 4 Wide supply voltage range 4.5 to 9.0 V Supports 4 and 8 loads 9-bump WL-CSP with 0.5 mm pitch SNR (A-weighted) 104 dB 2S battery pack THD+N: 94 dB 3.0 W, 8.2 V, 8 PSRR: 78 dB Applications Tablets Speaker accessories Personal navigation devices Handheld gaming devices Ultrabooks Datasheet Revision 3.2 01-Feb-2019 CFR0011-120-00 Rev 5 1 of 26 2019 Dialog Semiconductor DA7202 10 W Mono Class-D Amplifier for 2S Battery Devices Contents General description ............................................................................................................................. 1 Key features ......................................................................................................................................... 1 Applications ......................................................................................................................................... 1 Contents ............................................................................................................................................... 2 Figures .................................................................................................................................................. 3 Tables ................................................................................................................................................... 3 1 Terms and definitions ................................................................................................................... 4 2 Block diagram ................................................................................................................................ 5 3 Pinout ............................................................................................................................................. 6 4 Absolute maximum ratings .......................................................................................................... 7 5 Recommended operating conditions .......................................................................................... 8 6 Electrical characteristics .............................................................................................................. 9 7 Thermal protection ........................................................................................................................ 9 8 Functional description ................................................................................................................ 10 8.1 Pop and click suppression .................................................................................................. 10 8.2 Short circuit/over-current protection .................................................................................... 10 8.3 Thermal performance and thermal protection ..................................................................... 10 8.3.1 Thermal shutdown ............................................................................................... 10 8.3.2 Maximum power dissipation ................................................................................ 10 8.4 Gain ..................................................................................................................................... 11 8.5 Class D output stage ........................................................................................................... 11 8.6 Power down (PDN N) ......................................................................................................... 11 9 Typical performance plots .......................................................................................................... 12 9.1 THD versus output power (8 + 33 H) ............................................................................ 12 9.2 THD versus output power (4 + 33 H) ............................................................................ 12 9.3 THD versus frequency (8 + 33 H) 4.5 V ........................................................................ 13 9.4 THD versus frequency (4 + 33 H) 4.5 V ........................................................................ 13 9.5 THD versus frequency (8 + 33 H) 8.2 V ........................................................................ 14 9.6 THD versus frequency (4 + 33 H) 8.2 V ........................................................................ 14 9.7 THD versus frequency (8 + 33 H) 9.0 V ........................................................................ 15 9.8 THD versus frequency (4 + 33 H) 9.0 V ........................................................................ 15 9.9 Max Pout versus supply voltage (8 + 33 H) .................................................................... 16 9.10 Max Pout versus supply voltage (4 + 33 H) .................................................................... 16 9.11 Efficiency versus output power (8 + 33 H) .................................................................... 17 9.12 Efficiency versus output power (4 + 33 H) .................................................................... 17 9.13 Start-up timing ..................................................................................................................... 18 9.14 Shutdown timing .................................................................................................................. 18 9.15 Power dissipation versus output power (8 + 33 H) ....................................................... 19 9.16 Power dissipation versus output power (4 + 33 H) ....................................................... 19 9.17 Electromagnetic interference (EMI) performance ............................................................... 20 10 Application information .............................................................................................................. 21 10.1 PCB layout .......................................................................................................................... 21 10.2 Speaker selection ................................................................................................................ 21 Datasheet Revision 3.2 01-Feb-2019 CFR0011-120-00 Rev 5 2 of 26 2019 Dialog Semiconductor