DIGI WIRELESS CONNECTIVITY KIT Provides a hands-on way to learn how to use Digi XBee RF modules for device connectivity and sensor networking Starting with very simple examples, we provide step-by- step guidance in assembling the kit components to create The Kit Includes: reliable wireless communications, working control systems, 2 Digi XBee Grove Development Boards and sensing networks with incredible battery life and robust 3 security. The kit is designed for anyone getting started in the 2 Digi XBee 802.15.4 Modules 3 world of Digi XBee: hardware/software engineers, product managers, educators, students and even young inventors. 2 Micro-USB Cables 3 All examples are explained in-depth and include videos 2 Digi XBee Stickers 3 showcasing wireless communication in action. Some examples also incorporate the Digi XBee Java Library, which can be PART NUMBER DESCRIPTION used to integrate Digi XBees modules into Java-based devices XKB2-AT-WWC Wireless Connectivity Kit w/ Digi XBee S1 802.15.4 and applications. Each example is designed to be easy for anyone to use, and those with some programming background XKB2-A2T-WWC Wireless Connectivity Kit w/ Digi XBee S2C 802.15.4 should find it simple to extend the examples to additional applications or use-cases. Digi XBee 802.15.4 Modules Included in the Kit Digi XBee and XBee-PRO 802.15.4 modules are embedded Digi XBee 802.15.4 modules are ideal for low-power, low- solutions providing wireless connectivity to devices. These cost applications. These modules are easy-to-use, share a modules use the IEEE 802.15.4 networking protocol for fast common footprint, and are fully interoperable with other point-to-multipoint or peer-to-peer networking. They are XBee products utilizing the same technology. Module users designed for high-throughput applications requiring low have the ability to substitute one Digi XBee module for latency and predictable communication timing. another with minimal development time and risk. www.digi.comSPECIFICATIONS Digi XBee S2C 802.15.4 Digi XBee-PRO S2C 802.15.4 PERFORMANCE TRANSCEIVER CHIPSET Silicon Labs EM357 SoC RF 250 Kbps, Serial up to 1 Mbps DATA RATE 200 ft (60 m) 300 ft (90 m) INDOOR/URBAN RANGE OUTDOOR/RF LINE-OF-SIGHT 4000 ft (1200 m) 2 miles (3200 m) RANGE 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm) TRANSMIT POWER 63 mW (+18 dBm) boost mode RECEIVER SENSITIVITY (1% PER) -100 dBm / -102 dBm boost mode -101 dBm FEATURES SERIAL DATA INTERFACE UART, SPI CONFIGURATION METHOD API or AT commands, local or over-the-air (OTA) ISM 2.4 GHz FREQUENCY BAND Through-Hole, Surface Mount FORM FACTOR HARDWARE S2C INTERFERENCE IMMUNITY DSSS (Direct Sequence Spread Spectrum) ADC INPUTS (4) 10-bit ADC inputs DIGITAL I/O 15 Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire ANTENNA OPTIONS SMT: RF Pad, PCB Antenna, or U.FL Connector -40 C to +85 C OPERATING TEMPERATURE DIMENSIONS (L X W X H) AND Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm) Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) WEIGHT NETWORKING AND SECURITY PROTOCOL ZigBee PRO 2007, HA-Ready with support for binding/multicasting UPDATABLE TO DIGIMESH Yes PROTOCOL UPDATABLE TO ZIGBEE Yes PROTOCOL ENCRYPTION 128-bit AES Retries/Acknowledgements RELIABLE PACKET DELIVERY IDS PAN ID and addresses, cluster IDs and endpoints (optional) CHANNELS 16 channels 15 channels POWER REQUIREMENTS SUPPLY VOLTAGE 2.1 to 3.6V 2.7 to 3.6V 33 mA 3.3 VDC / 45 mA boost mode 120 mA 3.3 VDC TRANSMIT CURRENT RECEIVE CURRENT 28 mA 3.3 VDC / 31 mA boost mode 31 mA 3.3 VDC POWER-DOWN CURRENT <1 A 25 C <1 A 25 C REGULATORY APPROVALS FCC, IC (NORTH AMERICA) Yes Yes Yes No ETSI (EUROPE) RCM (AUSTRALIA AND No (Coming soon) No (Coming soon) NEW ZEALAND) TELEC (JAPAN) No (Coming soon) No www.digi.com