BAS40W /-04 /-05 /-06 SURFACE MOUNT SCHOTTKY BARRIER DIODE Features Mechanical Data Low Forward Voltage Drop Case: SOT323 Fast Switching Case Material: Molded Plastic,Gree Molding Compound, Ultra-Small Surface Mount Package Note 4. UL Flammability Classification Rating 94V-0 PN Junction Guard Ring for Transient and ESD Protection Moisture Sensitivity: Level 1 per J-STD-020D e3 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Terminals: Solderable per MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Polarity: See Diagrams Below Weight: 0.006 grams (approximate) Top View BAS40W BAS40W-04 BAS40W-05 BAS40W-06 Ordering Information (Notes 4 & 5) Part Number Case Packaging BAS40W-7-F SOT323 3000/Tape & Reel BAS40W-13-F SOT323 10000/Tape & Reel BAS40W-04-7-F SOT323 3000/Tape & Reel BAS40W-05-7-F SOT323 3000/Tape & Reel BAS40W-06-7-F SOT323 3000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BAS40W /-04 /-05 /-06 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit V Peak Repetitive Reverse Voltage RRM Working Peak Reverse Voltage 40 V V RWM DC Blocking Voltage V R RMS Reverse Voltage V 28 V R(RMS) Forward Continuous Current (Note 6) I 200 mA FM Non-Repetitive Peak Forward Surge Current t = 1.0s I 600 mA FSM Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 6) P 200 mW D Thermal Resistance Junction to Ambient Air (Note 6) 625 R C/W JA Operating Temperature Range -55 to +125 T C J Storage Temperature Range -65 to +150 C T STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Max Unit Test Condition Reverse Breakdown Voltage (Note 7) V 40 V I = 10 A (BR)R R 380 mV I = 1.0mA, t < 300 s F p Forward Voltage V F 1000 mV I = 40mA, t < 300 s F p Leakage Current (Note 7) I 200 nA V = 30V R R Total Capacitance C 5.0 pF V = 0, f = 1.0MHz T R I = I = 10mA, F R Reverse Recovery Time t 5.0 ns rr I = 0.1 x I , R = 100 rr R L Notes: 6. Device mounted on FR4 PC board with recommended pad layout, per