BAS40W /-04 /-05 /-06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features Mechanical Data
Low Forward Voltage Drop Case: SOT323
Fast Switching Case Material: Molded Plastic,Gree Molding Compound,
Ultra-Small Surface Mount Package Note 4. UL Flammability Classification Rating 94V-0
PN Junction Guard Ring for Transient and ESD Protection Moisture Sensitivity: Level 1 per J-STD-020D
e3
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Terminals: Solderable per MIL-STD-202, Method 208
Halogen and Antimony Free. Green Device (Note 3) Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagrams Below
Weight: 0.006 grams (approximate)
Top View BAS40W BAS40W-04 BAS40W-05 BAS40W-06
Ordering Information (Notes 4 & 5)
Part Number Case Packaging
BAS40W-7-F SOT323 3000/Tape & Reel
BAS40W-13-F SOT323 10000/Tape & Reel
BAS40W-04-7-F SOT323 3000/Tape & Reel
BAS40W-05-7-F SOT323 3000/Tape & Reel
BAS40W-06-7-F SOT323 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See
BAS40W /-04 /-05 /-06
Maximum Ratings (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
V
Peak Repetitive Reverse Voltage RRM
Working Peak Reverse Voltage 40 V
V
RWM
DC Blocking Voltage
V
R
RMS Reverse Voltage V 28 V
R(RMS)
Forward Continuous Current (Note 6) I 200 mA
FM
Non-Repetitive Peak Forward Surge Current @ t = 1.0s I 600 mA
FSM
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 6) P 200 mW
D
Thermal Resistance Junction to Ambient Air (Note 6) 625
R C/W
JA
Operating Temperature Range -55 to +125
T C
J
Storage Temperature Range -65 to +150 C
T
STG
Electrical Characteristics (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 7) V 40 V I = 10 A
(BR)R R
380 mV I = 1.0mA, t < 300 s
F p
Forward Voltage V
F
1000
mV I = 40mA, t < 300 s
F p
Leakage Current (Note 7) I 200 nA V = 30V
R R
Total Capacitance C 5.0 pF V = 0, f = 1.0MHz
T R
I = I = 10mA,
F R
Reverse Recovery Time t 5.0 ns
rr
I = 0.1 x I , R = 100
rr R L
Notes: 6. Device mounted on FR4 PC board with recommended pad layout, per