BZT52C2V0 - BZT52C51 SURFACE MOUNT ZENER DIODE Features Mechanical Data Planar Die Construction Case: SOD123 500mW Power Dissipation Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 General Purpose, Medium Current Moisture Sensitivity: Level 1 per J-STD-020 Ideally Suited for Automated Assembly Processes Terminals: Matte Tin Finish annealed over Alloy 42 leadframe Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Notes 3 & 4) Polarity: Cathode Band Qualified to AEC-Q101 Standards for High Reliability Weight: 0.010 grams (approximate) SOD123 Top View Ordering Information (Notes 5 & 6) Part Number Qualification Case Packaging (Type Number)-7-F Commercial SOD123 3000/Tape & Reel (Type Number)Q-7-F Automotive SOD123 3000/Tape & Reel (Type Number)-13-F Commercial SOD123 10,000/Tape & Reel (Type Number)Q-13-F Automotive SOD123 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BZT52C2V0 - BZT52C51 Maximum Ratings ( T = +25C, unless otherwise specified.) A Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol Value Unit Forward Voltage I = 10mA V 0.9 V F F Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 7) TL = +75C P 500 mW D Power Dissipation (Note 8) TA = +25C P 370 mW D Thermal Resistance, Junction to Ambient Air (Note 8) 338 R C/W JA Thermal Resistance, Junction to Lead (Note 9) 150 R C/W JL Operating and Storage Temperature Range T T -65 to +150 C J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Maximum Maximum Zener Temperature Zener Voltage Range Reverse Test Impedance Coefficient (Note 10) Current Current Type Marking f = 1kHz I ZTC (Note 10) Number Codes I ZTC mV/C V I I Z I Z I I I V Z ZT ZT ZT ZT ZK ZK ZK R R Nom (V) Min (V) Max (V) mA mA uA V Min Max mA BZT52C2V0 WY 2.0 1.91 2.09 5 100 600 1.0 150 1.0 -3.5 0 5 BZT52C2V4 WX 2.4 2.2 2.6 5 100 600 1.0 50 1.0 -3.5 0 5 BZT52C2V7 W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0 5 BZT52C3V0 W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0 5 BZT52C3V3 W3 3.3 3.1 3.5 5 95 600 1.0 5.0 1.0 -3.5 0 5 BZT52C3V6 W4 3.6 3.4 3.8 5 90 600 1.0 5.0 1.0 -3.5 0 5 BZT52C3V9 W5 3.9 3.7 4.1 5 90 600 1.0 3.0 1.0 -3.5 0 5 BZT52C4V3 W6 4.3 4.0 4.6 5 90 600 1.0 3.0 1.0 -3.5 0 5 BZT52C4V7 W7 4.7 4.4 5.0 5 80 500 1.0 3.0 2.0 -3.5 0.2 5 BZT52C5V1 W8 5.1 4.8 5.4 5 60 480 1.0 2.0 2.0 -2.7 1.2 5 BZT52C5V6 W9 5.6 5.2 6.0 5 40 400 1.0 1.0 2.0 -2 2.5 5 BZT52C6V2 WA 6.2 5.8 6.6 5 10 150 1.0 3.0 4.0 0.4 3.7 5 BZT52C6V8 WB 6.8 6.4 7.2 5 15 80 1.0 2.0 4.0 1.2 4.5 5 BZT52C7V5 WC 7.5 7.0 7.9 5 15 80 1.0 1.0 5.0 2.5 5.3 5 BZT52C8V2 WD 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 5 BZT52C9V1 WE 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 5 BZT52C10 WF 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 5 BZT52C11 WG 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 5 BZT52C12 WH 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 5 BZT52C13 WI 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 5 BZT52C15 WJ 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 5 BZT52C16 WK 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 5 BZT52C18 WL 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 5 BZT52C20 WM 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0 5 BZT52C22 WN 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 - 5 BZT52C24 WO 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 - 5 BZT52C27 WP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 - 2 BZT52C30 WQ 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 - 2 BZT52C33 WR 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 - 2 BZT52C36 WS 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 - 2 BZT52C39 WT 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 - 2 BZT52C43 WU 43 40.0 46.0 5 100 700 1.0 0.1 32.0 37.6 - 5 BZT52C47 WV 47 44.0 50.0 5 100 750 1.0 0.1 35.0 42.0 - 5 BZT52C51 WW 51 48.0 54.0 5 100 750 1.0 0.1 38.0 46.6 - 5 Notes: 7. R = 132C/W JL 2 8. Device mounted on ceramic PCB with copper pad areas 40mm . 9. Thermal Resistance measurement obtained via infrared scan method. 10. Short duration pulse test used to minimize self-heating effect. 2 of 5 September 2012 BZT52C2V0 - BZT52C51 Diodes Incorporated www.diodes.com Document number: DS18004 Rev. 37 - 2