BZT52C9V1LPQ - BZT52C16LPQ SURFACE MOUNT ZENER DIODE Features Mechanical Data Ultra-Small Leadless Surface Mount Package Case: X1-DFN1006-2 Ideally Suited for Automated Assembly Processes Case Material: Molded Plastic,Gree Molding Compound. Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) UL Flammability Classification Rating 94V-0 Halogen and Antimony Free. Green Device (Note 3) Moisture Sensitivity: Level 1 per J-STD-020 Qualified to AEC-Q101 Standards for High Reliability Terminal Connections: See Marking Information PPAP Capable (Note 4) Terminals: FinishNiPdAu over Copper Leadframe. Solderable per MIL-STD-202, Method 208 e4 Weight: 0.001 grams (Approximate) Bottom View Ordering Information (Note 5) Part Number Compliance Case Packaging BZT52C9V1LPQ-7 Automotive X1-DFN1006-2 3000/Tape & Reel BZT52C13LPQ-7 Automotive X1-DFN1006-2 3000/Tape & Reel BZT52C15LPQ-7 Automotive X1-DFN1006-2 3000/Tape & Reel BZT52C16LPQ-7 Automotive X1-DFN1006-2 3000/Tape & Reel Add -7 to the appropriate type num ber in Electrical Characteristics Table. Exam ple: 9.1V Zener = BZT52C9V1LPQ-7 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) com pliant. 2. See BZT52C9V1LPQ - BZT52C16LPQ Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Forward Voltage (Note 6) I = 10mA V 0.9 V F F Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 7) T = +25C P 250 mW A D 500 C/W Thermal Resistance, Junction to Ambient Air (Note 7) T = +25C R A JA Operating and Storage Temperature Range T T -65 to +150 C J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Maximum Temperature Zener Voltage Range Maximum Zener Impedance Reverse Test Coefficient (Note 6) f = 1kHz Current Current Type Marking I ZTC (Note 6) Number Code I ZTC mV/C V I I Z I Z I I I V Z ZT ZT ZT ZT ZK ZK ZK R R Nom (V) Min (V) Max (V) mA mA A V Min Max mA BZT52C9V1LPQ 9F 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 5 BZT52C13LPQ 9K 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 5 BZT52C15LPQ 9L 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 5 BZT52C16LPQ 9M 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 5 Notes: 6. Short duration pulse test used to m inimize self-heating effect. 7. Device m ounted on FR-4 PCB with m inimum recommended pad layout, as shown in Diodes Incorporateds Suggested Pad Layout document, which can be found at