BZT52C3V9LP-7 Diodes Incorporated

BZT52C2V4LP - BZT52C39LP SURFACE MOUNT ZENER DIODE Features Mechanical Data Ultra-Small Leadless Surface Mount Package Case: X1-DFN1006-2 Ideally Suited for Automated Assembly Processes Case Material: Molded Plastic,Gree Molding Compound Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) UL Flammability Classification Rating 94V-0 Halogen and Antimony Free. Green Device (Note 3) Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: See Marking Information Terminals: Finish NiPdAu over Copper Leadframe e4 Solderable per MIL-STD-202, Method 208 Weight: 0.001 grams (Approximate) Bottom View Ordering Information (Note 4) Part Number Compliance Case Packaging (Type Number)-7* Commercial X1-DFN1006-2 3,000/Tape & Reel (Type Number)-7B** Commercial X1-DFN1006-2 10,000/Tape & Reel *Add -7 to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7. **Add -7B to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7B. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BZT52C2V4LP - BZT52C39LP Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Forward Voltage (Note 5) I = 10mA V 0.9 V F F Thermal Characteristics Characteristic Symbol Value Unit 250 mW Power Dissipation (Note 6) T = +25C P A D Thermal Resistance, Junction to Ambient Air (Note 6) T = +25C R 500 C/W A JA Operating and Storage Temperature Range T T -65 to +150 C J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Maximum Temperature Zener Voltage Range Maximum Zener Impedance Reverse Test Coefficient (Note 5) f = 1kHz Current Current Type Marking I ZTC (Note 5) Number Code I ZTC mV/C V I I Z I Z I I I V Z ZT ZT ZT ZT ZK ZK ZK R R Nom (V) Min (V) Max (V) mA mA A V Min Max mA BZT52C2V4LP WX 2.4 2.20 2.60 5 100 600 1.0 50 1.0 -3.5 0 5 BZT52C2V7LP W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0 5 BZT52C3V0LP W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0 5 BZT52C3V3LP W3 3.3 3.1 3.5 5 95 600 1.0 5 1.0 -3.5 0 5 BZT52C3V6LP W4 3.6 3.4 3.8 5 90 600 1.0 5 1.0 -3.5 0 5 BZT52C3V9LP W5 3.9 3.7 4.1 5 90 600 1.0 3 1.0 -3.5 0 5 BZT52C4V3LP W6 4.3 4.0 4.6 5 90 600 1.0 3 1.0 -3.5 0 5 BZT52C4V7LP W7 4.7 4.4 5.0 5 80 500 1.0 3 2.0 -3.5 0.2 5 BZT52C5V1LP 9Y 5.1 4.8 5.4 5 60 480 1.0 2.0 2.0 -2.7 1.2 5 BZT52C5V6LP 9A 5.6 5.2 6.0 5 40 400 1.0 1.0 2.0 -2 2.5 5 BZT52C6V2LP 9B 6.2 5.8 6.6 5 10 150 1.0 3.0 4.0 0.4 3.7 5 BZT52C6V8LP 9C 6.8 6.4 7.2 5 15 80 1.0 2.0 4.0 1.2 4.5 5 (Note 7) BZT52C7V5LP 9D 7.5 7.0 7.9 5 15 80 1.0 1.0 5.0 2.5 5.3 5 BZT52C8V2LP 9E 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 5 BZT52C9V1LP 9F 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 5 BZT52C10LP 9G 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 5 BZT52C11LP 9H 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 5 BZT52C12LP 9J 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 5 BZT52C13LP 9K 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 5 BZT52C15LP 9L 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 5 BZT52C16LP 9M 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 5 BZT52C18LP 9N 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 5 BZT52C20LP 9P 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 - 5 BZT52C22LP 9R 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 - 5 BZT52C24LP 9S 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 - 5 BZT52C36LP 9W 36 34.0 38.0 2 90 350 0.5 0.1 25.2 36.5 - 5 BZT52C39LP 9X 39 37.0 41.0 2 130 350 0.5 0.1 27.3 36.8 - 5 Notes: 5. Short duration pulse test used to minimize self-heating effect. 6. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporateds Suggested Pad Layout document, which can be found on our website at