BZT52HC30WF-7 Diodes Incorporated

BZT52HC2V4WF - BZT52HC47WF SURFACE MOUNT ZENER DIODE Features Mechanical Data Flat Lead Package Design for Low Profile and High Power Case: SOD123F (Type B) Dissipation Case Material: Molded Plastic,Gree Molding Compound. Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) UL Flammability Classification Rating 94V-0 Halogen and Antimony Free. Green Device (Note 3) Moisture Sensitivity: Level 1 per J-STD-020 Qualified to AEC-Q101 Standards for High Reliability Terminal Connections: Cathode Band Terminals: Finish - Matte Tin Annealed over Copper Alloy e3 Leadframe. Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Weight: 0.015 grams (Approximate) SOD123F (Type B) Top View Bottom View Ordering Information (Note 4) Part Number Compliance Case Packaging (Type Number)-7* AEC-Q101 SOD123F (Type B) 3,000/Tape & Reel *Add -7 to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener = BZT52HC6V2WF-7. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BZT52HC2V4WF - BZT52HC47WF Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Forward Voltage (Note 5) I = 10mA V 0.9 V F F Forward Current I 250 mA F Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 6) 375 mW P D Power Dissipation (Note 7) P 830 mW D Thermal Resistance, Junction to Ambient Air (Note 6) R 330 C/W JA Thermal Resistance, Junction to Ambient Air (Note 7) R 150 C/W JA Operating and Storage Temperature Range T T -65 to +150 C J, STG Note: 5. Short duration pulse test used to minimize self-heating effect. 6. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporateds Suggested Pad Layout document, which can be found on our website at