BZT585B13T-7 Diodes Incorporated

BZT585B2V4T - BZT585B43T SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data 2.0% Tolerance on Breakdown Voltage Case: SOD523 Small, Low Profile Surface Mount Package Case Material: Molded Plastic,Gree Molding Compound. Flat Lead Package Design for Low Profile and High Power UL Flammability Classification Rating 94V-0 Dissipation Moisture Sensitivity: Level 1 per J-STD-020 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Terminal Connections: Cathode Band Halogen and Antimony Free. Green Device (Note 3) Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe. e3 Qualified to AEC-Q101 Standards for High Reliability Solderable per MIL-STD-202, Method 208 Weight: 0.001 grams (approximate) Top View Ordering Information (Note 4) Part Number Case Packaging (Type Number)-7* (Note 4) SOD523 3000/Tape & Reel *Add -7 to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener = BZT585B6V2T-7. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BZT585B2V4T - BZT585B43T Maximum Ratings ( T = +25C, unless otherwise specified.) A Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Symbol Value Unit Forward Voltage I = 10mA 0.9 F V V F 1.1 I = 100mA F Continuous Forward Current I 200 mA F Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) 350 mW P D Thermal Resistance, Junction to Ambient Air (Note 5) 357 C/W R JA Operating and Storage Temperature Range -65 to +150 C T T J, STG Note: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporateds Suggested Pad Layout document, which can be found on our website at