Green DBF210 2A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Product Summary ( T = +25C) Features and Benefits A Glass Passivated Die Construction V (V) I (A) V (V) I (A) RRM O F R Miniature Package Saves Space on PC Boards 1000 2 1.0 5 Low Leakage Current Ideal for SMT Manufacturing Low Forward Voltage Drop Surge Overload Rating to 70A Peak Lead-Free Finish RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Description and Applications Mechanical Data Suitable for AC to DC bridge full wave rectification for SMPS, LED lighting, adapter, battery charger, home appliances, office equipment, Case: DBF and telecommunication applications. Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: As Marked on Body Weight: 0.214 grams (Approximate) Top View Internal Schematic Ordering Information (Note 4) Part Number Compliance Case Packaging DBF210-13 Commercial DBF 3,000/Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See DBF210 Maximum Ratings ( T = +25C, unless otherwise specified.) A Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol Value Unit V Peak Repetitive Reverse Voltage RRM Working Peak Reverse Voltage 1000 V V RWM DC Blocking Voltage V R RMS Reverse Voltage V 700 V R(RMS) Average Rectified Output Current (Note 5) T = +110C I 2.0 A C O Non-Repetitive Peak Forward Surge Current, 8.3ms I 70 A FSM Single Half Sine-Wave Superimposed on Rated Load 2 2 2 20.34 I t Rating for Fusing (1ms < t < 8.3ms) I t A S Thermal Characteristics Characteristic Symbol Value Unit Typical Thermal Resistance, Junction to Ambient (Note 6) R 50 C/W JA (Per Element) Typical Thermal Resistance, Junction to Case (Per Element) 10 C/W R JC Operating and Storage Temperature Range -55 to +150 C T T J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 7) 1,000 V V I = 5A (BR)R R 0.85 0.95 I = 1A, T = +25C F A Forward Voltage (Per Element) V V F 0.93 1.0 I = 2A, T = +25C F A 0.03 V = 1,000V, T = +25C 5 R A Leakage Current (Note 7) (Per Element) A I R 500 11 V = 1,000V, T = +125C R A Total Capacitance (Per Element) 25 pF C V = 4V, f = 1.0MHz T R 2 Notes: 5. Device mounted on glass epoxy PC board with 1.3mm solder pad. 2 6. Device mounted on glass epoxy substrate with 1oz/ft , 15mmx15mm copper pad per pin. 7. Short duration pulse test used to minimize self-heating effect. 2 of 5 DBF210 January 2018 Diodes Incorporated www.diodes.com Document number: DS39301 Rev. 3 - 2 ADVANCED INFORMATION NEW PRODUCT