Green DBF2510 2.5A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Product Summary ( T = +25C) Features and Benefits A Glass Passivated Die Construction V (V) I (A) V (V) I (A) RRM O F R Miniature Package Saves Space on PC Boards 1,000 2.5 1.0 5 Low Leakage Current Ideal for SMT Manufacturing Low Forward Voltage Drop Surge Overload Rating to 80A Peak Lead-Free Finish RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Mechanical Data Description and Applications Suitable for AC to DC bridge full wave rectification for SMPS, LED Case: DBF lighting, adapter, battery charger, home appliances, office equipment, Case Material: Molded Plastic. UL Flammability Classification and telecommunication applications. Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: As Marked on Body Weight: 0.214 grams (Approximate) Internal Schematic Top View Ordering Information (Note 4) Part Number Compliance Case Packaging DBF2510-13 Commercial DBF 3,000/Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See DBF2510 Maximum Ratings ( T = +25C, unless otherwise specified.) A Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage V RRM Working Peak Reverse Voltage V 1,000 V RWM DC Blocking Voltage VR RMS Reverse Voltage 700 V V R(RMS) 2.5 A Average Rectified Output Current (Note 5) T = +110C I C O Non-Repetitive Peak Forward Surge Current, 8.3ms 80 A I FSM Single Half Sine-Wave Superimposed on Rated Load 2 2 2 I t Rating for Fusing (1ms < t < 8.3ms) I t 26.56 A S Thermal Characteristics Characteristic Symbol Value Unit Typical Thermal Resistance, Junction to Ambient (Note 6) 35 C/W R JA (Per Element) Typical Thermal Resistance, Junction to Case (Per Element) R 7.8 C/W JC Operating and Storage Temperature Range T T -55 to +150 C J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition 1,000 Reverse Breakdown Voltage (Note 7) V V I = 5A (BR)R R 0.85 0.95 I = 1.25A, T = +25C F A Forward Voltage (Per Element) V V F 0.93 1.0 IF = 2.5A, TA = +25C 0.03 5 V = 1,000V, T = +25C R A Leakage Current (Note 7) (Per Element) I A R 15 500 V = 1,000V, T = +125C R A 30 Total Capacitance (Per Element) C pF V = 4V, f = 1.0MHz T R 2 Notes: 5. Device mounted on glass epoxy PC board with 1.3mm solder pad. 2 6. Device mounted on glass epoxy substrate with 1oz/ft , 30mmx30mm copper pad per pin. 7. Short duration pulse test used to minimize self-heating effect. 2 of 5 DBF2510 January 2018 Diodes Incorporated www.diodes.com Document number: DS39408 Rev. 3 - 2 ADVANCED INFORMATION NEW PRODUCT