DFLS230 2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER PowerDI 123 Features Guard Ring Die Construction for Transient Protection Low Power Loss, High Efficiency PowerDI 123 Patented Interlocking Clip Design for High Surge Current Dim Min Max Typ D Capacity H A 3.50 3.90 3.70 Low Forward Voltage Drop B 2.60 3.00 2.80 A Lead Free Finish, RoHS Compliant (Note 5) C 1.63 1.93 1.78 Gree Molding Compound (No Br, Sb) B D 0.93 1.00 0.98 E 0.85 1.25 1.00 Mechanical Data C E H 0.15 0.25 0.20 Case: PowerDI 123 L 0.45 0.85 0.65 Case Material: Molded Plastic,Gree Molding Compound. L L L1 UL Flammability Classification Rating 94V-0 L1 1.35 Moisture Sensitivity: Level 1 per J-STD-020C L2 1.10 E L2 Terminal Connections: Cathode Band L3 0.20 Terminals: Finish Matte Tin annealed over Copper L4 0.90 1.30 1.05 L3 L4 leadframe. Solderable per MIL-STD-202, Method 208 e3 A All Dimensions in mm Marking & Type Code Information: See Last Page Ordering Information: See Last Page Weight: 0.01 grams (approximate) T = 25 C unless otherwise specified A Maximum Ratings Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage V RRM Working Peak Reverse Voltage V RWM 30 V DC Blocking Voltage V R V RMS Reverse Voltage R(RMS) 21 V Average Forward Current T = 120C T I 2.0 A F(AV) Non-Repetitive Peak Forward Surge Current 8.3ms I FSM 40 A single half sine-wave superimposed on rated load Power Dissipation (Note 1) P 1.67 W D Power Dissipation (Note 2) P 556 mW D Thermal Resistance Junction to Ambient (Note 1) R JA 60 C/W R Thermal Resistance Junction to Ambient (Note 2) JA 180 C/W Thermal Resistance Junction to Soldering (Note 3) R 10 C/W JS Operating Temperature Range T -55 to +125 C j Storage Temperature Range T -55 to +150 C STG T = 25 C unless otherwise specified A Electrical Characteristics Characteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 4) V I = 1.5mA (BR)R 30 V R I = 1.0A 0.36 0.42 F Forward Voltage V F V I = 2.0A 0.4 0.49 F I V = 30V, T = 25 C Leakage Current (Note 4) R 0.15 1.0 mA R A Total Capacitance C 75 pF V = 10V, f = 1.0MHz T R Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. T = 25 C A 2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. T = 25 C A 3. Theoretical R calculated from the top center of the die straight down to the PCB cathode tab solder junction. JS 4. Short duration pulse test to minimize self-heating effect. 5. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see EU Directive Annex Note 7. DS30518 Rev. 2 - 1 1 of 3 DFLS230 PowerDI is a trademark of Diodes Incorporated. www.diodes.com Diodes Incorporated10 10,000 T=85C A 1000 T=125C A T=100C A 1 100 T=25C A T=125C A 0.1 10 T=100C A 1 T=85C A 0.01 T=-40C T=25C A A .1 T=-40C A .01 0.001 5 10 15 20 25 30 0 0.2 0.4 0.6 0.8 1.0 V , INSTANTANEOUS FORWARD VOLTAGE (V) V , INSTANTANEOUS REVERSE VOLTAGE (V) R F Fig.1,Typical Forward Characteristics Fig. 2, Typical Reverse Characteristics 1000 f= 1MHz 100 10 1 0 5 10 15 20 V , DC REVERSE VOLTAGE (V) R Fig. 3, Typical Total Capacitance DS30518 Rev. 2 - 1 2 of 3 DFLS230 PowerDI is a trademark of Diodes Incorporated. www.diodes.com C,TOTAL CAPACITANCE (pF) T I , INSTANTANEOUS FORWARD CURRENT (A) F