GDZ8V2BLP3-7 Diodes Incorporated

GDZ8V2BLP3 ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm) Case: X3-DFN0603-2 Ultra-Low Profile Package (0.3mm) Case Material: Molded Plastic, Green Molding Compound. Ideally Suited for Automated Assembly Processes UL Flammability Classification Rating 94V-0 Low Leakage Current, Suitable for Battery-Powered Applications Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: Cathode Bar Lead Free By Design/RoHS Compliant (Note 1) Terminals: Finish Matte Tin over Copper leadframe. Halogen and Antimony FreeGree Device (Notes 2 & 3) Solderable per MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.2 mg (Approximate) Top View Bottom View Ordering Information (Note 4) Part Number Case Packaging GDZ8V2BLP3-7 X3-DFN0603-2 10,000/Tape & Reel Notes: 1. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free 2. Halogen and Antimony freeGreen products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 3. Diodes Inc. sGree policy can be found on our website at GDZ8V2BLP3 Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) T = 25C P 250 mW A D 500 Thermal Resistance, Junction to Ambient Air (Note 5) T = 25C R C/W A JA Operating and Storage Temperature Range T T -55 to +150 C J, STG Electrical Characteristics T = 25C unless otherwise specified A Maximum Zener Voltage Range Reverse (Note 6) Current Type Marking (Note 6) Number Code V I I I V Z ZT ZT R R Nom (V) Min (V) Max (V) mA A V GDZ8V2BLP3 KI, KR 8.2 7.995 8.405 5 0.5 5.0 Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporateds Suggested Pad Layout document, which can be found on our website at