PDR3G 3A GLASS PASSIVATED RECTIFIER PowerDI 5 Features Glass Passivated Die Construction A D Low Leakage Current A2 b2 High Forward Surge Current Capability L1 PowerDI 5 Lead Free Finish, RoHS Compliant (Note 1) Min Max Dim E E1 Gree Molding Compound (No Br, Sb) A 1.05 1.15 Qualified to AEC-Q101 Standards for High Reliability A2 0.33 0.43 L1 b1 0.80 0.99 e b1 b1 A2 b2 1.70 1.88 Mechanical Data D D 3.90 4.05 Case: PowerDI 5 D2 D2 3.05 NOM b2 Case Material: Molded Plastic, Green Molding L E 6.40 6.60 Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C e 1.84 NOM E2 E Terminals: Finish Matte Tin annealed over Copper 5.30 5.45 E1 W e3 L1 leadframe. Solderable per MIL-STD-202, Method 208 E2 3.55 NOM Polarity: See Diagram e L 0.75 0.95 Marking: See Page 3 b1 b1 L1 0.50 0.65 Weight: 0.095 grams (approximate) LEFT PIN W 1.20 1.50 BOTTOMSIDE HEAT SINK RIGHT PIN All Dimensions in mm Note: Pins Left & Right must be electrically connected at the printed circuit board. T = 25C unless otherwise specified A Maximum Ratings Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Value Characteristic Symbol Unit V Peak Repetitive Reverse Voltage RRM V Working Peak Reverse Voltage RWM 400 V V DC Blocking Voltage R RMS Reverse Voltage V 283 V R(RMS) Average Rectified Output Current (See also figure 4) I 3 A O Non-Repetitive Peak Forward Surge Current I FSM 100 A 8.3ms Single half sine-wave Superimposed on Rated Load Thermal Characteristics Characteristic Symbol Typ Max Unit Thermal Resistance Junction to Soldering Point R qJS 2.0 C/W Thermal Resistance Junction to Ambient Air (Note 2) R qJA 75 C/W R Thermal Resistance Junction to Ambient Air (Note 3) qJA 65 C/W Thermal Resistance Junction to Ambient Air (Note 4) R 45 C/W qJA Operating Temperature Range T -65 to +150 C j Storage Temperature Range T STG -65 to +150 C Notes: 1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7. 2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per T = 25C unless otherwise specified A Electrical Characteristics Min Typ Max Unit Characteristic Symbol Test Condition Reverse Breakdown Voltage (Note 5) V 400 V I = 10mA (BR)R R Forward Voltage V I = 3A, T = 25C F 0.92 1.15 V F S T = 25C, V = 400V 0.015 10 S R Reverse Leakage Current (Note 5) I mA R T = 125C, V = 400V 6 250 S R I = 0.5A, I = 1.0A, F R t Reverse Recovery Time rr 3.0 ms I = 0.25A rr Notes: 5. Short duration test pulse used to minimize self-heating effect. 100 T = +150C j 10 1 T = +125C j T = 150C j 100m T = +85C j T = 85C j 10m 100n T = 25C j 1m T = +25C j 10n T = -65C j T = -65C j 1n 0 0.2 0.4 1.0 1.2 80 160 240 400 0.6 0.8 0 320 V , INSTANTANEOUS FORWARD VOLTAGE (V) F V , INSTANTANEOUS REVERSE VOLTAGE (V) R Fig. 1 Typical Forward Characteristics Fig. 2 Typical Reverse Characteristics 40 3.75 f = 1 MHz 3.0 30 2.25 Note 4 20 1.5 Note 2 10 0.75 0 0 0 5 15 30 10 20 25 0 25 50 75 100 125 150 V , REVERSE VOLTAGE (V) T , AMBIENT TEMPERATURE (C) R A Fig. 3 Typical Total Capacitance vs. Reverse Voltage Fig. 4 DC Forward Current Derating DS30547 Rev. 7 - 2 2 of 3 PDR3G PowerDI is a trademark of Diodes Incorporated. www.diodes.com I , INSTANTANEOUS FORWARD CURRENT (A) C , TOTAL CAPACITANCE (pF) F T I , DC FORWARD CURRENT (A) I , INSTANTANEOUS REVERSE CURRENT (A) F R