ZXGD3112N7
400V ACTIVE OR-ING MOSFET CONTROLLER IN SO7
Description Features
The ZXGD3112N7 is a 400V active ORing MOSFET controller Active OR-ing MOSFET Controller for High- or Low-Side PSU
designed for driving a very low R power MOSFET as an ideal Ideal Diode to Reduce Forward Voltage Drop
DS(ON)
diode. This replaces the standard rectifier to reduce the forward -3mV Typical Turn-Off Threshold with 2mV Tolerance
voltage drop and overall increase the power transfer efficiency. 400V Drain Voltage Rating
25V V Rating
CC
The ZXGD3112N7 can be used on both high-side and low-side power <50mW Standby Power with Quiescent Supply Current <1mA
supply units (PSU) with rails up to 400V. It enables very low R <600ns Turn-Off Time to Minimize Reverse Current
DS(ON)
MOSFETs to operate as ideal diodes as the turn-off threshold is Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
only -3mV with 2mV tolerance. In the typical 48V configuration, the Halogen and Antimony Free. Green Device (Note 3)
standby power consumption is <50mW as the low quiescent supply
current is <1mA. During PSU fault condition, the ORing controller
detects the power reduction and rapidly turns off the MOSFET in
<600ns to block reverse current flow and avoid the common bus
voltage dropping.
Applications Mechanical Data
Active ORing Controller in: Case: SO-7
Case Material: Molded Plastic. Green Molding Compound.
(N + 1) Redundant Power Supplies
UL Flammability Rating 94V-0
Telecom and Networking
Moisture Sensitivity: Level 1 per J-STD-020
Data Centers and Servers
Terminals: FinishMatte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.074 grams (Approximate)
SO-7
1 7
GND DRAIN
2
GND
3 6
Vcc PGND
4 5
PGND
GATE
Top View
Top View
Pin-Out
Ordering Information (Note 4)
Product Marking Reel Size (inches) Tape Width (mm) Quantity per Reel
ZXGD3112N7TC ZXGD3112 13 12 2500
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See
ZXGD3112N7
Pin Functions
Pin Number Pin Name Pin Function and Description
Ground
1, 2 GND
Connect this pin to the MOSFET source terminal and ground reference point.
Power Supply
3 V
CC
This supply pin should be closely decoupled to ground with a X7R type capacitor.
Gate Drive
4 GATE This pin sources (I ) and sinks (I ) current into the MOSFET gate. If V > 12V, then the GATE-to-GND
SOURCE SINK CC
will clamp at 12V. The turn on time of the MOSFET can be programmed through an external gate resistor (R ).
G
Power Ground
5, 6 PGND
Connect this pin to the MOSFET source terminal and ground reference point.
Drain Sense
7 DRAIN
Connect this pin to the MOSFET drain terminal to detect the change in drain-source voltage.
Absolute Maximum Ratings (Voltage relative to GND, @ T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Supply Voltage 25 V
V
CC
Drain Pin Voltage -3 to 400 V
V
D
Gate Output Voltage** V
V -3 to V + 3
G CC
Gate Driver Peak Source Current 2 A
I
SOURCE
Gate Driver Peak Sink Current I 5 A
SINK
**Gate voltage is clamped to 12V.
Thermal Characteristics
Characteristic Symbol Value Unit
490
(Note 5)
3.92
655
(Note 6)
Power Dissipation 5.24 mW
P
D
Linear Derating Factor mW/C
720
(Note 7)
5.76
785
(Note 8)
6.28
(Note 5) 255
(Note 6) 191
Thermal Resistance, Junction to Ambient C/W
R
JA
(Note 7) 173
(Note 8) 159
Thermal Resistance, Junction to Lead (Note 9) 135 C/W
R
JL
Operating and Storage Temperature Range -50 to +150 C
T , T
J STG
ESD Ratings (Note 10)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic DischargeHuman Body Model ESD HBM 2000 V 3A
Electrostatic DischargeMachine Model ESD MM 200 V B
Notes: 5. For a device surface mounted on minimum recommended pad layout FR-4 PCB with high coverage of single sided 1oz copper, in still air conditions; the
device is measured when operating in a steady-state condition.
6. Same as Note 5, except pin 3 (V ) and pins 5 & 6 (PGND) are both connected to separate 5mm 5mm 1oz copper heat-sinks.
CC
7. Same as Note 6, except both heat-sinks are 10mm 10mm.
8. Same as Note 6, except both heat-sinks are 15mm 15mm.
9. Thermal resistance from junction to solder-point at the end of each lead on pins 2 & 3 (GND) and pins 5 & 6 (V ).
CC
10. Refer to JEDEC specification JESD22-A114 and JESD22-A11.
2 of 14
October 2018
ZXGD3112N7
Diodes Incorporated
www.diodes.com
Document Number DS37739 Rev. 3 - 2