REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Made technical change in table I. Added test circuit and switching waveforms. 89-12-07 W. Heckman Editorial changes throughout. B Change IAW NOR No. 5962-R151-93 adding footnote 2/ to table I. Editorial 93-05-05 Monica L. Poelking changes throughout. - tvn C Update to reflect latest changes in format and requirements. Editorial changes 02-03-20 Raymond Monnin throughout. - les D Update drawing to current requirements. Editorial changes throughout. - gap 09-04-14 Joseph D. Rodenbeck The original first sheet of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86074 01 R X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F322 8-bit serial/parallel register with sign extend and three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage .................................................................................... -0.5 V dc to +7.0 V dc Input voltage range ............................................................................ -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range ................................................................ -65C to +150 C ) per device 1/ ................................ 495 mW Maximum power dissipation (PD Lead temperature (soldering, 10 seconds) ........................................ +300 C Thermal resistance, junction-to-case ( ) ........................................ See MIL-STD-1835 JC Junction temperature (T ) .................................................................. +175 C J 1.4 Recommended operating conditions. Supply voltage range (V ) ................................................................ +4.5 V dc minimum to +5.5 V dc maximum CC Minimum high level input voltage (V ) ............................................... 2.0 V dc IH ) ............................................... 0.8 V dc Maximum low level input voltage (VIL Case operating temperature range (TC) ............................................ -55 C to +125 C Setup time, high RE to CP (t ) ......................................................... 8.0 ns minimum s Setup time, low RE to CP (t ) .......................................................... 18.0 ns minimum s Hold time, high or low, RE to CP (t ) ............................................... 0 ns minimum h Setup time, high or low, D , D , or I/O to CP (t ) ............................. 8.5 ns minimum 0 1 n s Hold time, high or low, D , D , or I/O to CP (t ) ............................... 3.0 ns minimum 0 1 n h 1/ Maximum power dissipation is defined as V x I . Must withstand the added P due to short circuit test (e.g. I ). CC CC D OS SIZE STANDARD 5962-86074 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 D 2 DSCC FORM 2234 APR 97