REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change screening and group A inspections. Update table I. Update vendor s 87-06-22 M. A. Frye part number. B Make changes to table I, 1.2.2, 1.3, 4.2a, and 4.3.2b. Editorial changes 88-06-23 M. A. Frye throughout. Make change to table II. C Add vendor CAGE number 01295 to the drawing as a supplier for device 02. 89-12-13 M. A. Frye Add burn-in test condition A to 4.2 and 4.3.2. Changes to table I and figure 4, pages 11 and 12. Editorial changes throughout. D Change to vendor similar Part or Identifying Number (PIN) for vendor CAGE 92-03-04 M. A. Frye 01295. Editorial changes throughout. E Update drawing to current requirements. Editorial changes throughout. - gap 02-01-04 Raymond Monnin CURRENT CAGE CODE 67268 REV SHEET REV E SHEET 15 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamison DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43216 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86709 01 X X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 82S105 16 x 48 x 8, field programmable, logic sequencer, (FPLS) 02 82S105 16 x 48 x 8, field programmable, logic sequencer, (FPLS) 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y GDFP2-F28 28 Flat pack 3 CQCC1-N28 28 Leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage ..................................................................... 7.0 V dc maximum Input voltage ....................................................................... 10.0 V dc maximum during programming and 5.5 V dc maximum during operation. Storage temperature range ................................................. -65C to +150C Maximum power dissipation 1/ .......................................... 1.018 W Lead temperature (soldering, 10 seconds) .......................... +300C Thermal resistance, junction-to-case ( ): JC Cases X, Y, and 3 ............................................................ See MIL-STD-1835 Junction temperature (TJ) .................................................... +150C Output sink current 2/ ........................................................ 100 mA 1.4 Recommended operating conditions. Supply voltage range (VCC) .................................................. 4.5 V dc to 5.5 V dc Minimum high level input voltage (V ) ................................ 2.0 V dc IH Maximum low level input voltage (V ) ................................. 0.8 V dc IL Case operating temperature range (T ) .............................. -55C to +125C C 1/ Must withstand the added P due to short-circuit test e.g., I . D OS 2/ Not applicable for device type 02. SIZE STANDARD 5962-86709 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43216-5000 E 2 DSCC FORM 2234 APR 97