5962-8680503QA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED Added four device types and updated format. Added two vendors 91-03-27 M. A. Frye A CAGE 1FN41 and 34649. B Changes in accordance with NOR 5962-R212-92. 92-05-15 M. A. Frye C Changes in accordance with NOR 5962-R301-92. 92-09-05 M. A. Frye D Changes in accordance with NOR 5962-R227-94. 94-07-05 M. A. Frye E Updated format to include QML vendor paragraphs. ksr 00-07-24 Raymond Monnin F Boilerplate update, part of 5 year review. ksr 06-05-31 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN CHANGED REV SHEET REV SHEET REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CHECKED BY STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86805 01 Q A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 64K x 16-bit UVEPROM 300 ns 02 64K x 16-bit UVEPROM 250 ns 03 64K x 16-bit UVEPROM 200 ns 04 64K x 16-bit UVEPROM 170 ns 05 64K x 16-bit UVEPROM 150 ns 06 64K x 16-bit UVEPROM 120 ns 07 64K x 16-bit UVEPROM 90 ns 08 64K x 16-bit UVEPROM 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 dual-in-line package 2/ X CQCC1-N44 44 square chip carrier package 2/ 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Storage temperature range ---------------------------------------------------- -65 C to +150C All input or output voltage with respect to ground ----------------------- -0.6 V dc to V +0.5 V dc CC Voltage on pin A with respect to ground ----------------------------------- -0.6 V dc to +13.5 V dc 9 Power dissipation (P ) 3/ ------------------------------------------------------ 330 mW D Lead temperature (soldering, 10 seconds)--------------------------------- +300C Thermal resistance, junction-to-case ( ) --------------------------------- See MIL-STD-1835 JC Junction temperature (T ) 4/--------------------------------------------------- +150 C J Data retention---------------------------------------------------------------------- 10 years, minimum Endurance-------------------------------------------------------------------------- 50 cycles byte, minimum 1.4 Recommended operating conditions. Case operating temperature range (T ) ------------------------------------ -55C to +125C C Supply voltage range (V ) ---------------------------------------------------- +4.5 V dc to +5.5 V dc CC 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in QML-38535 and MIL-HDBK-103. 2/ Lid shall be transparent to permit ultraviolet light erasure. 3/ Must withstand the added P due to short-circuit test e.g., I . D OS 4/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. SIZE STANDARD 5962-86805 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 F 2 DSCC FORM 2234 APR 97