REVISIONS LTR DESCRIPTION DATE APPROVED A Changes in accordance with NOR 5962-R008-91. 91-10-17 Michael. A. Frye B Changes in accordance with NOR 5962-R217-93. 93-08-20 Michael. A. Frye C Updated boilerplate. Removed programming specifics from drawing, 00-08-30 Raymond Monnin including table III. Separated source bulletin from body of drawing. - glg D Corrected page number count on front page. Updated boilerplate. 04-11-30 Raymond Monnin ksr. E 5 year review and update. Changed input and output capacitance 06-06-12 Raymond Monnin from 6 pF to 10 pF and 8 pF to 10 pF respectively. ksr THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET E E E E E E E E E E E REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY DEFENSE SUPPLY CENTER COLUMBUS James E. Jamison COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-87529 01 L X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit Access time 01 1/ 2K x 8-registered UVEPROM 45 ns 02 1/ 2K x 8-registered UVEPROM 35 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style 2/ K GDFP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line package 3 CQCC1-N28 28 square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 3/ Supply voltage range......................................................... -0.5 V dc to +7.0 V dc DC voltage applied to outputs in high Z state .................... -0.5 to +7.0 V dc DC program voltage .......................................................... 14.0 V DC input voltage range ..................................................... -3.0 V dc to +7.0 V dc Storage temperature range ............................................... -65C to +150C Maximum power dissipation (P ): 4/................................. 1.0 W D Lead temperature (soldering, 10 seconds) ....................... +300C Junction temperature (T ) 5/............................................. +150C J Thermal resistance, junction-to-case ( ) ...................... See MIL-STD-1835 JC Endurance ......................................................................... 25 cycles/byte (minimum) Data retention.................................................................... 10 years minimum 1.4 Recommended operating conditions. Case operating temperature range (T )................................. -55C to +125C C Supply voltage range (V ) ..................................................... 4.5 V dc to 5.5 V dc CC 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ Lid shall be transparent to permit ultraviolet erasure. 3/ Unless otherwise specified, all voltages are referenced to ground. 4/ Must withstand the added P due to short-circuit test e.g., I . D OS 5/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. SIZE STANDARD 5962-87529 MICROCIRCUIT DRAWING A REVISION LEVEL SHEET DEFENSE SUPPLY CENTER COLUMBUS E 2 COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97