REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 93-11-05 M. A. Frye A Changes in accordance with NOR 5962-R026-94. 94-08-19 M. A. Frye B Updated boilerplate. Added device types 02 and 03. Removed programming requirements from drawing. TABLE I. changes. Editorial changes throughout. 06-09-13 Raymond Monnin C Boilerplate update, part of 5 year review. ksr REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Kenneth S. Rice DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87651 01 J A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 1K X 8-bit PROM 45 02 1K X 8-bit PROM 45 03 1K X 8-bit PROM 30 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J CDIP2-T24 or GDIP1-T24 24 Dual-in-line K CDFP3-F24 or GDFP2-F24 24 Flat package L CDIP4-T24 or GDIP3-T24 24 Dual-in-line 3 CQCC1-N28 28 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage range to ground potential (V )............................. -0.5 V dc to +7.0 V dc CC DC voltage range applied to the outputs in the high Z state.......... -0.5 V dc to +7.0 V dc DC input voltage ........................................................................... -3.0 V dc to +7.0 V dc Maximum power dissipation.......................................................... 1.0 W 3/ Lead temperature (soldering, 10 seconds).................................... +300C Thermal resistance, junction-to-case ( ) .................................... See MIL-STD-1835 JC Junction temperature (T ) ............................................................. +150C 4/ J Storage temperature range (T ) ................................................ -65C to +150C STG Temperature under bias................................................................ -55C to +125C Data retention ............................................................................... 10 years, minimum 1.4 Recommended operating conditions. Supply voltage range (V ) ........................................................... +4.5 V dc minimum to +5.5 V dc maximum CC Ground voltage (GND) .................................................................. 0 V dc Input high voltage range (V ) ....................................................... +2.0 V dc to V IH CC Input low voltage range (V ) ......................................................... -0.5 V dc to +0.8 V dc IL Case operating temperature range (T )........................................ -55C to +125C C 1/ Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin and in MIL-HDBK-103. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ Must withstand the added P due to short circuit test e.g., I . D OS 4/ Maximum junction temperature may be inceased to +175C during burn-in and steady state life tests. SIZE STANDARD A 5962-87651 MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 2 DSCC FORM 2234 APR 97