REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED Added Arrhenius equation for unbiased bake under margin test method 89-01-19 M. A. Frye A A, back end margin test step C. Corrected military part numbers for device types 01 and 02. Technical changes made to 1.2.2, table I, figure 1, figure 2, figure 4, figure 5, 4.3.1, and table II. Added vendor CAGE 34649 for device type 05. Editorial changes throughout. Add device type 08 for vendor CAGE number 66579. Add vendor 89-10-30 M. A. Frye B CAGE number 34335 to the drawing as a source of supply for the 08 device with changes to table I. Deleted programming cycle timing waveform and table III from drawing. Also deleted ESDS from drawing. Editorial changes throughout. Deleted vendor CAGE number 34335 as a source of supply for device 90-02-26 M. A. Frye C type 08. Added vendor CAGE number 34335 as a source of supply for device types 01 through 07. Deleted figure 5. Editorial changes throughout. Changes in accordance with NOR 5962-R079-95. 95-02-15 M. A. Frye D Added provisions for QD certification. Added CAGE 0C7V7 to drawing 99-12-03 Raymond Monnin E as a source of supply for device type 07. Updated boilerplate. - glg Boilerplate update, part of 5 year review. ksr 06-09-29 Raymond Monnin F Corrected footnote 1/ on section 1.2.2 package style heading to include 09-03-30 Robert M. Heber G all packages. Corrected test method number in 4.3.2 b (1). ksr The original first page of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY DEFENSE SUPPLY CENTER COLUMBUS Rick C. Officer CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD D. A. DiCenzo 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87661 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 27C128 16K x 8-bit UVEPROM 90 ns 02 27C128 16K x 8-bit UVEPROM 120 ns 03 27C128 16K x 8-bit UVEPROM 150 ns 04 27C128 16K x 8-bit UVEPROM 170 ns 05 27C128 16K x 8-bit UVEPROM 200 ns 06 27C128 16K x 8-bit UVEPROM 250 ns 07 27C128 16K x 8-bit UVEPROM 300 ns 08 27C128 16K x 8-bit UVEPROM 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style 1/ X GDIP1-T28 or CDIP2-T28 28 dual-in-line package Y CQCC1-N32 32 rectangular leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage range (V ) 2/..................................................... -0.6 V dc to 6.25 V dc CC Supply voltage range (V ) 2/..................................................... -0.6 V dc to 14.0 V dc PP All input voltage range except A 2/ .......................................... -0.6 V dc to 6.25 V dc 9 Input voltage range (A ) 2/.......................................................... -0.6 V dc to 13.5 V dc 9 Output voltage range 2/.............................................................. -0.6 V dc to V + 1.0 V dc CC Storage temperature range ........................................................ -65C to +150C Power dissipation ........................................................................ 300 mW Lead temperature (soldering, 10 seconds).................................. +300C Thermal resistance, junction-to-case ( )................................... See MIL-STD-1835 JC Junction temperature (T ) .......................................................... +150C 3/ J Data retention ............................................................................ 10 years minimum 1.4 Recommended operating conditions. Supply voltage range (V ) 4/ .................................................... 4.5 V dc to 5.5 V dc CC Supply voltage range (V ) 5/ ..................................................... 4.5 V dc to 5.5 V dc PP High level input voltage range (V ).............................................. 2.0 V dc to 6.5 V dc (TTL) IH High level input voltage range (V).............................................. V -0.2 V dc to V +0.2 V dc (CMOS) IH CC CC Low level input voltage range (V ) ............................................. -0.1 V dc to 0.8 V dc (TTL) IL Low level input voltage range (V ) ............................................. GND -0.2 to GND +0.2 V dc (CMOS) IL Case operating temperature range (T ) ...................................... -55C to +125C C 1/ Lid shall be transparent to permit ultraviolet light erasure. 2/ Under absolute maximum ratings, voltages are with respect to GND. 3/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. 4/ V must be applied before or at the same time as V and removed after or at the same time as V . The device must CC PP PP not be inserted into or removed from the board when V or V is applied. PP CC 5/ V can be connected to V directly (except in the program mode). V supply current in this case would be I + I . PP CC CC CC PP During programming, V must be maintained at 12.5 V (0.5 V). PP SIZE STANDARD A 5962-87661 MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 G 2 DSCC FORM 2234 APR 97