5962-8873503LA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change to table I, parameter t . Removed programming 89-09-11 Michael A. Frye PWC requirements. Editorial changes throughout. B Changes in accordance with NOR 5962-R006-91 91-09-24 Michael A. Frye C Changes in accordance with NOR 5962-R229-93 93-09-21 Michael A. Frye D Drawing updated to reflect current requirements. Removed 01-01-05 Raymond Monnin programming logic from truth table. Editorial changes throughout. - gap 5 year review and update. Changed input and output capacitance E 06-06-06 Raymond Monnin from 6 pF to 10 pF and 8 pF to 10 pF respectively. ksr THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY James E. Jamison DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Charles Reusing 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88735 01 L A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 7C245 2K X 8-bit registered PROM 45 ns 02 7C245 2K X 8-bit registered PROM 35 ns 03 7C245A 2K X 8-bit registered PROM 35 ns 04 7C245A 2K X 8-bit registered PROM 25 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line package 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (V ) ........................................................... -0.5 V dc to +7.0 V dc CC DC voltage applied to outputs in high Z state ................................ -0.5 V dc to +7.0 V dc DC program voltage (V ): PP Device types 01 and 02............................................................... 14.0 V dc Device types 03 and 04............................................................... 13.0 V dc DC input voltage............................................................................. -3.0 V dc to +7.0 V dc Storage temperature range............................................................ -65C to +150C Power dissipation (P ) 2/.............................................................. 1.0 W D Lead temperature (soldering, 10 seconds) .................................... +300C Junction temperature (T ) 3/ ......................................................... +150C J Thermal resistance, junction-to-case ()..................................... See MIL-STD-1835 JC 1.4 Recommended operating conditions. Supply voltage range (V ) ........................................................... +4.5 V dc to +5.5 V dc CC Case operating temperature range (T ) ....................................... -55C to +125C C 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ Must withstand the added P due to short-circuit test e.g., I . D OS 3/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. SIZE STANDARD 5962-88735 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 E 2 DSCC FORM 2234 APR 97