REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes 01-05-22 Raymond Monnin throughout. -les B Update drawing to current requirements. Editorial changes throughout. - gap 08-12-12 Robert M. Heber The original first sheet of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Thanh V. Nguyen 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89487 01 C X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F132 Quad 2-input NAND Schmitt trigger 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range ..................................................................... -0.5 V dc to minimum to +7.0 V dc maximum Input voltage range (V ) ............................................................... -0.5 V dc to minimum to +7.0 V dc maximum IN Input current range ........................................................................ -30.0 mA to +5.0 mA Voltage applied to output in high output state range ..................... -0.5 V to V CC Current applied to output in low output state ................................. 40 mA Storage temperature range ........................................................... -65C to +150 C Maximum power dissipation (P ) 1/ ............................................... 99.0 mW D Lead temperature (soldering, 10 seconds) .................................... +300C Thermal resistance, junction-to-case ( ) ..................................... See MIL-STD-1835 C Junction temperature (T ) .............................................................. +175C J 1.4 Recommended operating conditions. Supply voltage range (V ) ........................................................... +4.5 V dc to +5.5 V dc CC Maximum input clamp current (I ) ................................................ -18 mA IK Maximum high level output current (I ) ....................................... -1.0 mA OH Maximum low level output current (I ) ......................................... 20 mA OL Case operating temperature range (T ) ........................................ -55C to +125 C C 1/ Power dissipation is defined as V x I and must withstand the added P due to short circuit test, e.g., I . CC CC D OS SIZE STANDARD 5962-89487 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 B 2 DSCC FORM 2234 APR 97