REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated boilerplate. Added device type 03. Moved endurance and 94-03-31 M. A. Frye data retention testing requirements from Section 4 of drawing to Section 3 of drawing. Converted case outline to standard package. Editorial changes throughout. B Boilerplate update, part of 5 year review. ksr 06-02-10 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY DEFENSE SUPPLY CENTER COLUMBUS Kenneth Rice COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-89537 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit Access time 01 (see 6.6) 16K x 8-bit UV EPROM 65 ns 02 (see 6.6) 16K x 8-bit UV EPROM 55 ns 03 (see 6.6) 16K x 8-bit UV EPROM 45 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style 1/ Y CDIP3-T28 or GDIP4-T28 28 Dual-in-line Z GDFP2-F28 28 Flat package U CQCC1-N32 32 Rectangular leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range to ground potential (V ) ................................... -0.5 V dc to +7.0 V dc CC DC voltage range applied to the outputs in the high Z state ................ -0.5 V dc to +7.0 V dc DC input voltage ................................................................................. -3.0 V dc to +7.0 V dc Maximum power dissipation ................................................................ 1.0 W 2/ Lead temperature (soldering, 10 seconds).......................................... +260C Thermal resistance, junction-to-case ( ) ....................................... See MIL-STD-1835 JC Junction temperature (T)................................................................... +175C J Storage temperature range (T )....................................................... -65C to +150C STG Temperature under bias...................................................................... -55C to +125C Data retention...................................................................................... 10 years, minimum Endurance........................................................................................... 25 cycles/byte, minimum 1.4 Recommended operating conditions. Case operating temperature range (T).............................................. -55C to +125C C Input high voltage range (V ).............................................................. +2.0 V dc IH Input low voltage range (V )................................................................ +0.8 V dc IL Supply voltage range (V ).................................................................. +4.5 V dc to +5.5 V dc CC 1/ Lid shall be transparent to permit ultraviolet light erasure. 2/ Must withstand the added P due to short circuit test e.g. , I . D OS SIZE STANDARD 5962-89537 MICROCIRCUIT DRAWING A REVISION LEVEL SHEET DEFENSE SUPPLY CENTER COLUMBUS B 2 COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97