X-On Electronics has gained recognition as a prominent supplier of 5962-8973001LA(IDT) across the USA, India, Europe, Australia, and various other global locations. 5962-8973001LA(IDT) are a product manufactured by E2v. We provide cost-effective solutions for 5962-8973001LA(IDT), ensuring timely deliveries around the world.

5962-8973001LA(IDT) E2v

5962-8973001LA(IDT) electronic component of E2v
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See Product Specifications
Part No.5962-8973001LA(IDT)
Manufacturer: E2v
Category: Unclassified
Description: FCT543 IDT DIE - DIP
Integrated circuit with LVDS receiver/transmitter.
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 112.8443 ea
Line Total: USD 112.84 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 1
Multiples : 1
1 : USD 112.8443
10 : USD 96.2961
50 : USD 91.2318
100 : USD 57.7819

   
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We are delighted to provide the 5962-8973001LA(IDT) from our E2v manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 5962-8973001LA(IDT) and other electronic components in the E2v manufacturer and beyond.

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59628973001LA is a part of E2v and is a high-performance VME FPGA processor board. It is a full-length 6U platform with dual AMC cards mounted in the front and FPGA processing resources in the rear. The robust and reliable design of this board helps to provide a cost-effective solution for intensive signal processing applications. The device can be used in mission-critical applications and its VXS and VITA-55 compliant peripherals improve communication capabilities. It offers a comprehensive signal processing system with up to 18 high-speed SERDES lanes plus an integrated memory controller.

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