5962-9055502LA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes 02-02-21 Raymond Monnin throughout. - gap B Add QP Semiconductor as an approved source of supply and editorial 06-06-22 Raymond Monnin changes throughout. - tcr THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Rajesh Pithadia DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Kenneth S. Rice 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-90555 01 K X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function t PD 01 C20RA10 Asynchronous PLD 35 ns 02 C20RA10 Asynchronous PLD 25 ns 03 C20RA10 Asynchronous PLD 20 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3, X CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage to ground potential ................................................ -0.5 V dc to +7.0 V dc DC voltage applied to outputs in high Z state ............................... -0.5 V dc to +7.0 V dc DC input voltage ........................................................................... -3.0 V dc to +7.0 V dc Maximum power dissipation (P ) 2/ ............................................. 1.0 W D Lead temperature (soldering, 10 seconds) ................................... +260C Thermal resistance, junction-to-case ( ): ................................... See MIL-STD-1835 JC Junction temperature (T ) ............................................................. +175C J Storage temperature range ........................................................... -65C to +150C Temperature under bias ................................................................ -55C to +125C Output current into outputs (low) ................................................... -16 mA _______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added P due to short circuit test; e.g., I . D OS SIZE STANDARD 5962-90555 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 B 2 DSCC FORM 2234 APR 97