REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED F Change to vendor similar part number for vendor CAGE 18324. 91-10-30 M. A. Frye Changes to table I parameters t and C . Add vendor CAGE EA OUT 18324 to device types 03 and 04 as a source of supply. Add new device design for device 04 for vendor CAGE 07933. Removed table III, figure 5, and programming procedures. Editorial changes throughout. 93-02-12 G Changes in accordance with NOR 5962-R010-93 M. A. Frye 93-08-10 H Changes in accordance with NOR 5962-R205-93 M. A. Frye 97-05-29 J Updated boilerplate. Sheet 4, change V conditions from I = -2.0 Raymond Monnin OH OH mA to -1.6 mA change C max. limit from 10 pF to 15 pF change IN C max. limit for devices 01, 02, and 04 from 13 pF to OUT 20 pF add footnote 3 to t test column. Removed logic diagrams. DA Remove vendors CAGE 50364 and 34335 as suppliers, and removed their associated switching time test circuits. K Boilerplate update, part of 5 year review. ksr 05-06-30 Raymond Monnin L Boilerplate update, part of 5 year review. ksr 10-11-10 Charles F. Saffle CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV L L L L L L L L L L L L L OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Darrell Hill DLA LAND AND MARITIME CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 82008 01 J A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 4096 words x 8 bits per word PROM, T.S. 95 ns 02 4096 words x 8 bits per word PROM, T.S. 55 ns 03 4096 words x 8 bits per word PROM, T.S. 45 ns 04 4096 words x 8 bits per word PROM, T.S. 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line package K GDFP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line package X CQCC1-N32 32 rectangular leadless chip carrier 3 CQCC1-N28 28 square leadless chip carrier Y CDFP4-F24 24 flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (V ) .............................................................................. -0.3 to +7.0 V dc CC Input voltage range ................................................................................ +5.5 V dc Storage temperature range ................................................................... -65C to +150C Lead temperature (soldering, 10 seconds) ............................................ +300C Thermal resistance, junction-to-case ( ) ............................................ See MIL-STD-1835 2/ JC Output voltage applied ........................................................................... -0.3 V dc to V CC Output sink current ............................................................................... 100 mA Maximum power dissipation (P ) 3/ ...................................................... 1.04 W dc D Maximum junction temperature (T ) ....................................................... +175C J 1.4 Recommended operating conditions. Supply voltage range (V ) .................................................................... 4.5 V dc to 5.5 V dc CC Minimum high level input voltage (V ) .................................................. 2.0 V dc IH Maximum low level input voltage (V ) ................................................... 0.8 V dc IL Normalized fanout (each output) ........................................................... 12 mA Case operating temperature range (T ) ................................................ -55C to +125C C 1/ Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ Heat sinking is recommended to reduce the junction temperature. 3/ Must withstand the added P due to short circuit test (e.g., I ). D OS SIZE STANDARD 82008 A MICROCIRCUIT DRAWING DLA LAND AND MARITIME REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 L 2 DSCC FORM 2234 APR 97