8300102QA E2v

REVISIONS DATE LTR DESCRIPTION APPROVED (YR-MO-DA) C Convert to military drawing format. Add LCC package. Editorial changes throughout. 88-01-27 M. A. Frye Change code ident. no. from 14933 to 67268. D Update boilerplate to MIL-PRF-38535 requirements. Correct title to accurately reflect 05-03-23 Thomas M. Hess device function. - CFS THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV D D D D D D D D D D D D D SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 REV D D D D D D D D D D D D D D REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PREPARED BY PMIC N/A DEFENSE SUPPLY CENTER COLUMBUS James E. Jamison COLUMBUS, OHIO 43218-3990 CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 83001 01 Q A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Frequency Circuit function 01 Z8536/Z0853604 4 MHz Counter timer and parallel input/output peripheral unit 02 Z8536A/Z0853606 6 MHz Counter timer and parallel input/output peripheral unit 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line Y CQCC1-N44 44 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (V ) .......................................................................... -0.3 V dc to +7.0 V dc 1/ CC Voltage on any pin ....................................................................................... -0.3 V dc to V + 0.3 V dc 1/ CC Storage temperature range .......................................................................... -65C to +150C Maximum power dissipation (P ) at -55C ................................................... 1.2 W D Maximum power dissipation (P ) at +125C................................................. 0.60 W D Lead temperature (soldering, 10 seconds) .................................................. +270C Maximum junction temperature (T ) at T = +125C .................................... +170C J C Thermal resistance, junction-to-case ( ): JC Cases Q and Y...................................................................................... See MIL-STD-1835 1/ Voltages are referenced to ground. SIZE STANDARD 83001 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 D 2 DSCC FORM 2234 APR 97